Intel Xeon W-3175X Skylake 3.1 GHz LGA 3647 28-Core Processor (BX80673W3175X)

Intel
  • Intel Xeon W
  • W-3175X
  • LGA 3647
  • 3.1 GHz

SKU: B009-0288
Condition: New Sealed
Model Number: BX80673W3175X EAN/UPC: 5032037151191

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SKU: B009-0288 Category:
Processor
Cooler included No
Processor codename Skylake
Processor cache 38.5 MB
Processor ARK ID 189452
Processor frequency 3.1 GHz
Processor model W-3175X
Processor threads 56
System bus rate 8 GT/s
Processor operating modes 64-bit
Processor boost frequency 3.8 GHz
Bus type DMI3
Component for PC
Processor lithography 14 nm
Processor family Intel Xeon
Processor cores 28
Box Yes
Processor socket LGA 3647
Processor cache type Smart Cache
Memory
Maximum internal memory supported by processor 512 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2666 MHz
Memory channels supported by processor Hexa
ECC supported by processor Yes
Power
Thermal Design Power (TDP) 255 W
Technical details
Intel TSX-NI Yes
Intel vPro Technology Yes
Intel Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel Hyper Threading Technology (Intel HT Technology) Yes
Intel AES New Instructions (Intel AES-NI) Yes
Execute Disable Bit Yes
Enhanced Intel SpeedStep Technology Yes
PCI Express slots version 3.0
Supported instruction sets AVX,AVX 2.0,AVX-512,SSE4.2
Scalability 1S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available No
CPU configuration (max) 1
Product type 4
Processor cache 39424 KB
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 255 W
Status Launched
Market segment DT
Intel Virtualization Technology (VT-x) Yes
Processor cache type Smart Cache
Bus type units GT/s
Bus bandwidth 8
Intel TSX-NI version 1.00
Processor brand name Intel Xeon
Last change 63903513
Product family Intel Xeon Processors
Intel Speed Shift Technology version 1.00
Memory speed (max) 2666 MHz
Intel Volume Management Device (VMD) version 1.00
AVX-512 Fused Multiply-Add (FMA) units 2
Features
Maximum number of PCI Express lanes 48
Thermal Design Power (TDP) 255 W
Processor package size 76 x 56.5 mm
Processor ARK ID 189452
Execute Disable Bit Yes
PCI Express slots version 3.0
Supported instruction sets AVX,AVX 2.0,AVX-512,SSE4.2
Scalability 1S
Embedded options available No
CPU configuration (max) 1
Market segment DT
Processor special features
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Intel Turbo Boost Max Technology 3.0 No
Intel Speed Shift Technology Yes
Intel Optane Memory Ready No
Intel TSX-NI Yes
Intel vPro Technology Yes
Intel Turbo Boost Technology 2.0
Intel Trusted Execution Technology Yes
Intel Hyper Threading Technology (Intel HT Technology) Yes
Intel AES New Instructions (Intel AES-NI) Yes
Enhanced Intel SpeedStep Technology Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
Intel TSX-NI version 1.00
AVX-512 Fused Multiply-Add (FMA) units 2
Operational conditions
Tjunction 85 °C
Tcase 70 °C
Weight & dimensions
Processor package size 76 x 56.5 mm
Other features
Maximum internal memory 524288 MB
CPU configuration (max) 1

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