Intel Core i9-10900F Comet Lake 2.8 GHz LGA 1200 10-Core Processor (BX8070110900F)
- 10th gen Intel Core i9
- i9-10900F
- LGA 1200
- 2.8 GHz
SKU: B008-0305
Condition: New Sealed
Model Number: BX8070110900F EAN/UPC: 5032037188746
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Out of stock
US$ 289.99 inc. Tax
Out of stock
Intel Core i5-12400 Alder Lake 4.4 GHz LGA 1700 6-Core Processor (CM8071504650608) – OEM
Intel Core i5-12400 Alder Lake 4.4 GHz LGA 1700 6-Core Processor (CM8071504650608) – OEM
SKU: B008-0424
Condition: New Sealed
Model Number: CM8071504650608 EAN/UPC: 8592978355135
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Intel Core i9-11900F 2.5 GHz LGA 1200 8-Core Processor (BX8070811900F)
SKU: B008-0344
Condition: New Sealed
Model Number: BX8070811900F EAN/UPC: 5032037215626
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Intel Core i5-12500 Alder Lake 4.6 GHz LGA 1700 6-Core Processor (BX8071512500) – BOX
Intel Core i5-12500 Alder Lake 4.6 GHz LGA 1700 6-Core Processor (BX8071512500) – BOX
SKU: B008-0403
Condition: New Sealed
Model Number: BX8071512500 EAN/UPC: 5032037238564
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Intel Core i3-10105 3.7 GHz LGA 1200 4-Core Processor (BX8070110105)
SKU: B008-0346
Condition: New Sealed
Model Number: BX8070110105 EAN/UPC: 5032037214841
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Processor | |
---|---|
Processor manufacturer | Intel |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Processor cache | 20 MB |
Processor ARK ID | 199329 |
Processor frequency | 2.8 GHz |
Processor model | i9-10900F |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | 10th gen Intel Core i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics adapter | No |
On-board graphics adapter model | Not available |
On-board graphics adapter | No |
Discrete graphics adapter model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel Identity Protection Technology (Intel IPT) | Yes |
Intel Hyper Threading Technology (Intel HT Technology) | Yes |
Intel AES New Instructions (Intel AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1×16,2×8,1×8+2×4 |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Status | Launched |
Launch date | Q2’20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199329 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1×16,2×8,1×8+2×4 |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Harmonized System (HS) code | 8542310001 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel Optane Memory Ready | Yes |
Intel OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel Secure Key | Yes |
Intel Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel Identity Protection Technology (Intel IPT) | Yes |
Intel Hyper Threading Technology (Intel HT Technology) | Yes |
Intel AES New Instructions (Intel AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel Boot Guard | Yes |
Intel Thermal Velocity Boost | Yes |
Intel vPro Platform Eligibility | No |
Operational conditions | |
Tjunction | 100 °C |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
CPU configuration (max) | 1 |
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