Intel Processors
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Intel Core i9-10900F Comet Lake 2.8 GHz LGA 1200 10-Core Processor (BX8070110900F)
- 10th gen Intel Core i9
- i9-10900F
- LGA 1200
- 2.8 GHz
SKU: B008-0305
Condition: New Sealed
Model Number: BX8070110900F EAN/UPC: 5032037188746
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A$ 515.99 inc. VAT
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| Processor | |
|---|---|
| Processor manufacturer | Intel |
| Processor codename | Comet Lake |
| Memory bandwidth supported by processor (max) | 45.8 GB/s |
| Processor cache | 20 MB |
| Processor ARK ID | 199329 |
| Processor frequency | 2.8 GHz |
| Processor model | i9-10900F |
| Processor threads | 20 |
| System bus rate | 8 GT/s |
| Processor operating modes | 64-bit |
| Processor boost frequency | 5.2 GHz |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | 10th gen Intel Core i9 |
| Processor cores | 10 |
| Box | Yes |
| Processor socket | LGA 1200 (Socket H5) |
| Processor cache type | Smart Cache |
| Generation | 10th Generation |
| Memory | |
| Maximum internal memory supported by processor | 128 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory bandwidth supported by processor (max) | 45.8 GB/s |
| Memory channels | Dual-channel |
| ECC | No |
| Graphics | |
| Discrete graphics adapter | No |
| On-board graphics adapter model | Not available |
| On-board graphics adapter | No |
| Discrete graphics adapter model | Not available |
| Power | |
| Thermal Design Power (TDP) | 65 W |
| Technical details | |
| Intel Stable Image Platform Program (SIPP) | No |
| Thermal solution specification | PCG 2015C |
| Intel Secure Key | Yes |
| Thermal Monitoring Technologies | Yes |
| Intel Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | No |
| Intel Identity Protection Technology (Intel IPT) | Yes |
| Intel Hyper Threading Technology (Intel HT Technology) | Yes |
| Intel AES New Instructions (Intel AES-NI) | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1×16,2×8,1×8+2×4 |
| Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
| Scalability | 1S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Product type | Processor |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 65 W |
| Status | Launched |
| Launch date | Q2’20 |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | Smart Cache |
| Maximum memory | 128 GB |
| Bus speed | 8 GT/s |
| Features | |
| Maximum number of PCI Express lanes | 16 |
| Thermal Design Power (TDP) | 65 W |
| Processor package size | 37.5 x 37.5 mm |
| Processor ARK ID | 199329 |
| Thermal solution specification | PCG 2015C |
| Thermal Monitoring Technologies | Yes |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| PCI Express configurations | 1×16,2×8,1×8+2×4 |
| Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
| Scalability | 1S |
| Embedded options available | No |
| CPU configuration (max) | 1 |
| Harmonized System (HS) code | 8542310001 |
| PCI Express CEM revision | 3.0 |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | Yes |
| Intel Optane Memory Ready | Yes |
| Intel OS Guard | Yes |
| Intel Stable Image Platform Program (SIPP) | No |
| Intel Secure Key | Yes |
| Intel Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | No |
| Intel Identity Protection Technology (Intel IPT) | Yes |
| Intel Hyper Threading Technology (Intel HT Technology) | Yes |
| Intel AES New Instructions (Intel AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel Boot Guard | Yes |
| Intel Thermal Velocity Boost | Yes |
| Intel vPro Platform Eligibility | No |
| Operational conditions | |
| Tjunction | 100 °C |
| Weight & dimensions | |
| Processor package size | 37.5 x 37.5 mm |
| Other features | |
| CPU configuration (max) | 1 |
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