AMD EPYC 7343 3.2 GHz Socket SP3 16-Core Processor (100-000000338)
- AMD EPYC
- 7343
- Socket SP3
- 3.2 GHz
SKU: B009-0528
Condition: New Sealed
Model Number: 100-000000338 EAN/UPC: 0
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Out of stock
US$ 1,016.99 inc. Tax
Out of stock
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DELIVERY
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RETURNS
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Condition: New Sealed
Model Number: 100-000000043 EAN/UPC: 5054444255491
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
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Condition: New Sealed
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DELIVERY
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RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Intel Xeon 5317 FCLGA4189 3 GHz 12-Core Processor (CD8068904657302) – OEM
SKU: B009-0658
Condition: New Sealed
Model Number: CD8068904657302 EAN/UPC: 675901957120
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
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Processor | |
---|---|
Processor base frequency | 3.2 GHz |
Processor manufacturer | AMD |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 190 W |
Processor cache | 128 MB |
Processor model | 7343 |
Processor threads | 32 |
Processor boost frequency | 3.9 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 16 |
Processor socket | Socket SP3 |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Power | |
Configurable TDP-down | 165 W |
Thermal Design Power (TDP) | 190 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 190 W |
Configurable TDP-up | 200 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 190 W |
PCI Express slots version | 4.0 |
Processor special features | |
Configurable TDP-up | 200 W |
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