AMD EPYC 7373X 3.8 GHz Socket SP3 16-Core Processor (100-000000508) – OEM
- AMD EPYC
- 7373X
- Socket SP3
- 3.8 GHz
SKU: B009-0701
Condition: New Sealed
Model Number: 100-000000508 EAN/UPC: 8592978370152
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Out of stock
US$ 2,249.99 inc. Tax
Out of stock
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Condition: New Sealed
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DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
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Condition: New Sealed
Model Number: CD8069504194202 EAN/UPC: 8592978160647
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
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Condition: New Sealed
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DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
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SKU: B009-0444
Condition: New Sealed
Model Number: BX806954208 EAN/UPC: 5032037162104
DELIVERY
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RETURNS
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Processor | |
---|---|
Processor base frequency | 3.05 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 225 W |
Thermal Design Power (TDP) | 240 W |
Processor cache | 768 MB |
Processor model | 7373X |
Processor threads | 32 |
Processor boost frequency | 3.8 GHz |
Processor family | AMD EPYC |
Processor cores | 16 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 280 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 225 W |
Thermal Design Power (TDP) | 240 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 240 W |
Market segment | Server |
Configurable TDP-up | 280 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 240 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Processor special features | |
Configurable TDP-up | 280 W |
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