AMD EPYC 7313 3 GHz Socket SP3 16-Core Processor (100-000000329)
- AMD EPYC
- 7313
- Socket SP3
- 3 GHz
SKU: B009-0529
Condition: New Sealed
Model Number: 100-000000329 EAN/UPC: 8592978306618
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Only 7 left in stock - FREE Delivery by: Friday, Mar 22 - Wednesday, Mar 27
US$ 754.99 inc. Tax
Only 7 left in stock - FREE Delivery by: Friday, Mar 22 - Wednesday, Mar 27
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DELIVERY
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RETURNS
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AMD EPYC 7313 3 GHz Socket SP3 16-Core Processor (100-000000329)
SKU: B009-0529
Condition: New Sealed
Model Number: 100-000000329 EAN/UPC: 8592978306618
DELIVERY
Free shipping on all orders. 1 to 4 business days delivery with 1 business day dispatch, Monday to Friday…Read More.
RETURNS
Free returns on all orders. 30 day return policy. Free returns on all faulty items within the manufacturer warranty period…Read More.
Processor | |
---|---|
Processor base frequency | 3 GHz |
Processor manufacturer | AMD |
Cooler included | No |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Processor cache | 128 MB |
Processor model | 7313 |
Processor threads | 32 |
Processor boost frequency | 3.7 GHz |
Component for | Server/workstation |
Processor family | AMD EPYC |
Processor cores | 16 |
Box | No |
Processor socket | Socket SP3 |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Memory | |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 3200 MHz |
Memory channels | Octa-channel |
Memory bandwidth (max) | 204.8 GB/s |
Graphics | |
Discrete graphics adapter | No |
On-board graphics adapter model | Not available |
On-board graphics adapter | No |
Discrete graphics adapter model | Not available |
Power | |
Configurable TDP-down | 155 W |
Thermal Design Power (TDP) | 155 W |
Technical details | |
PCI Express slots version | 4.0 |
Thermal Design Power (TDP) | 155 W |
Market segment | Server |
Configurable TDP-up | 180 W |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 128 |
Thermal Design Power (TDP) | 155 W |
PCI Express slots version | 4.0 |
Market segment | Server |
Processor special features | |
Configurable TDP-up | 180 W |
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