Intel Processors
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Intel Core i9-10900KF Comet Lake 3.7 GHz LGA 1200 10-Core Processor (BX8070110900KF)
- 10th gen Intel Core i9
- i9-10900KF
- LGA 1200
- 3.7 GHz
SKU: B008-0288
Condition: New Sealed
Model Number: BX8070110900KF EAN/UPC: 5032037188661
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€ 476,19 inc. VAT
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Processor | |
---|---|
Processor manufacturer | Intel |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Processor cache | 20 MB |
Processor ARK ID | 199331 |
Processor frequency | 3.7 GHz |
Processor model | i9-10900KF |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | 10th gen Intel Core i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics adapter | No |
On-board graphics adapter model | Not available |
On-board graphics adapter | No |
Discrete graphics adapter model | Not available |
Power | |
Configurable TDP-down | 95 W |
Thermal Design Power (TDP) | 125 W |
Configurable TDP-down frequency | 3300 MHz |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015D |
Intel Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel Identity Protection Technology (Intel IPT) | Yes |
Intel Hyper Threading Technology (Intel HT Technology) | Yes |
Intel AES New Instructions (Intel AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1×16,2×8,1×8+2×4 |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 125 W |
Status | Launched |
Launch date | Q2’20 |
Intel Virtualization Technology (VT-x) | Yes |
Configurable TDP-down frequency | 3300 MHz |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 125 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199331 |
Thermal solution specification | PCG 2015D |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1×16,2×8,1×8+2×4 |
Supported instruction sets | SSE4.1,SSE4.2,AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Harmonized System (HS) code | 8542310001 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel Optane Memory Ready | Yes |
Intel OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel Secure Key | Yes |
Intel Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel Identity Protection Technology (Intel IPT) | Yes |
Intel Hyper Threading Technology (Intel HT Technology) | Yes |
Intel AES New Instructions (Intel AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel Boot Guard | Yes |
Intel Thermal Velocity Boost | Yes |
Intel vPro Platform Eligibility | No |
Operational conditions | |
Tjunction | 100 °C |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
CPU configuration (max) | 1 |
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