Intel Core i7-10700KF Comet Lake 3.8 GHz LGA 1200 8-Core Processor (BX8070110700KF)
Intel Core i7-10700KF Comet Lake 3.8 GHz LGA 1200 8-Core Processor (BX8070110700KF) - Image 2
Intel Core i7-10700KF Comet Lake 3.8 GHz LGA 1200 8-Core Processor (BX8070110700KF) - Image 3
Intel Core i7-10700KF Comet Lake 3.8 GHz LGA 1200 8-Core Processor (BX8070110700KF) - Image 4

Intel Core i7-10700KF Comet Lake 3.8 GHz LGA 1200 8-Core Processor (BX8070110700KF)

Intel
  • 10th gen Intel Core i7
  • i7-10700KF
  • LGA 1200
  • 3.8 GHz

SKU: B008-0286
Condition: New Sealed
Model Number: BX8070110700KF EAN/UPC: 5032037188685

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SKU: B008-0286 Category:
Processor
Processor manufacturer Intel
Processor codename Comet Lake
Memory bandwidth supported by processor (max) 45.8 GB/s
Processor cache 16 MB
Processor ARK ID 199325
Processor frequency 3.8 GHz
Processor model i7-10700KF
Processor threads 16
System bus rate 8 GT/s
Processor operating modes 64-bit
Processor boost frequency 5.1 GHz
Component for PC
Processor lithography 14 nm
Processor family 10th gen Intel Core i7
Processor cores 8
Box Yes
Processor socket LGA 1200 (Socket H5)
Processor cache type Smart Cache
Generation 10th Generation
Memory
Maximum internal memory supported by processor 128 GB
Memory types supported by processor DDR4-SDRAM
Memory clock speeds supported by processor 2933 MHz
Memory bandwidth supported by processor (max) 45.8 GB/s
Memory channels Dual-channel
ECC No
Graphics
Discrete graphics adapter No
On-board graphics adapter model Not available
On-board graphics adapter No
Discrete graphics adapter model Not available
Power
Configurable TDP-down 95 W
Thermal Design Power (TDP) 125 W
Configurable TDP-down frequency 3500 MHz
Technical details
Intel Stable Image Platform Program (SIPP) No
Thermal solution specification PCG 2015D
Intel Secure Key Yes
Thermal Monitoring Technologies Yes
Intel Turbo Boost Technology 2.0
Intel Trusted Execution Technology No
Intel Identity Protection Technology (Intel IPT) Yes
Intel Hyper Threading Technology (Intel HT Technology) Yes
Intel AES New Instructions (Intel AES-NI) Yes
Idle States Yes
Execute Disable Bit Yes
Enhanced Intel SpeedStep Technology Yes
PCI Express slots version 3.0
PCI Express configurations 1×16,2×8,1×8+2×4
Supported instruction sets SSE4.1,SSE4.2,AVX 2.0
Scalability 1S
Intel VT-x with Extended Page Tables (EPT) Yes
Embedded options available No
CPU configuration (max) 1
Product type Processor
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Thermal Design Power (TDP) 125 W
Status Launched
Launch date Q2’20
Intel Virtualization Technology (VT-x) Yes
Configurable TDP-down frequency 3500 MHz
Processor cache type Smart Cache
Maximum memory 128 GB
Bus speed 8 GT/s
Features
Maximum number of PCI Express lanes 16
Thermal Design Power (TDP) 125 W
Processor package size 37.5 x 37.5 mm
Processor ARK ID 199325
Thermal solution specification PCG 2015D
Thermal Monitoring Technologies Yes
Idle States Yes
Execute Disable Bit Yes
PCI Express slots version 3.0
PCI Express configurations 1×16,2×8,1×8+2×4
Supported instruction sets SSE4.1,SSE4.2,AVX 2.0
Scalability 1S
Embedded options available No
CPU configuration (max) 1
Harmonized System (HS) code 8542310001
PCI Express CEM revision 3.0
Processor special features
Intel Software Guard Extensions (Intel SGX) Yes
Intel Virtualization Technology for Directed I/O (VT-d) Yes
Intel 64 Yes
Intel Turbo Boost Max Technology 3.0 Yes
Intel Optane Memory Ready Yes
Intel OS Guard Yes
Intel Stable Image Platform Program (SIPP) No
Intel Secure Key Yes
Intel Turbo Boost Technology 2.0
Intel Trusted Execution Technology No
Intel Identity Protection Technology (Intel IPT) Yes
Intel Hyper Threading Technology (Intel HT Technology) Yes
Intel AES New Instructions (Intel AES-NI) Yes
Enhanced Intel SpeedStep Technology Yes
Intel VT-x with Extended Page Tables (EPT) Yes
Intel Virtualization Technology (VT-x) Yes
Intel Boot Guard Yes
Intel Thermal Velocity Boost No
Intel vPro Platform Eligibility No
Operational conditions
Tjunction 100 °C
Weight & dimensions
Processor package size 37.5 x 37.5 mm
Other features
CPU configuration (max) 1

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